Dynatron Q2 Intel Alder Lake-S Socket LGA 1700 Aluminum Copper CPU Heatsink 155W TDP Shuttle Convertible to tower with stand
Description
Convertible to tower with stand
Max 3200 MHz DIMM Frequency Video ASPEED AST2500
Case Dimensions 5
Average Latency: 5
A computer operating system
Dynatron Q2 Intel Alder Lake-S Socket LGA 1700 Aluminum Copper CPU Heatsink 155W TDP Shuttle Convertible to tower with standManufacturer Dynatron Model Number Q2 CPU Support Supports Intel Alder Lake S Socket LGA 1700 LGA1851 Up to 155W TDP Dimensions 90 x 90 x 66mm 3. 54" x 3. 54" x 2. 6" (in inches, approximate) Weight 653. 5 g Features Shin Etsu 7762 Thermal Grease
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