2390 Tie Point Premium Solderless Breadboard with 4 Binding Posts, Metal Backplate Standard configuration interface: USB Device
Description
Standard configuration interface: USB Device
less than or equal
Tests TTL and CMOS displays pulse presence and logic states memory mode "freezes" pulse display catches pulses to 30ns or pulse trains to 20 MHz 1 M input impedance
such as practical experiments in engineering
Tests 1200VDC and 1000VAC
2390 Tie Point Premium Solderless Breadboard with 4 Binding Posts, Metal Backplate Standard configuration interface: USB DeviceSolderless breadboard ideal for testing, prototyping and experimentation Contact Points: 2,390 Terminal Strips: 3 Bus Strips: 5 Binding Posts: 4 Features a sturdy aluminum backing Nickel plated clips Size: 9. 4" x 7. 7"
Exchange/Return Notes
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